Data center interconnect: planning 800G, 1.6T and optics
From high-speed Ethernet and optical interconnect to scalable platforms, data-center networking decisions are becoming increasingly systematic.
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GBA TECHNOLOGYHONG KONG
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GBA Technology tracks the evolution of AI computing, server platforms, advanced memory, enterprise storage and high-speed interconnects. We synthesize product roadmaps, architecture shifts, workload demand and industry developments into enterprise market trends and industry intelligence.
LATEST PERSPECTIVES
Our market insights are updated as new products, standards and infrastructure trends emerge, providing enterprise readers with timely technology trends and industry intelligence.
From high-speed Ethernet and optical interconnect to scalable platforms, data-center networking decisions are becoming increasingly systematic.
Read the research ↗Advances in high-bandwidth memory, server memory and enterprise storage are changing platform-planning trade-offs.
Read the research ↗Visibility into EOL, long lead times and substitution options helps procurement make effective decisions earlier.
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GPU / AI Accelerators
HBM, interconnect, rack-scale systems and next-generation roadmaps across NVIDIA Hopper, Blackwell, Vera Rubin and AMD Instinct MI400.
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GPU / AI Accelerators
Memory working sets, form factor and power, MIG and virtual workstations from RTX A6000 and RTX 6000 Ada to RTX PRO Blackwell.
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CPU / Server Platforms
Core density, memory, PCIe Gen6 and AI host CPU trends across AMD EPYC 9006 Venice, Intel Xeon 6+, Diamond Rapids and NVIDIA Vera.
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Server Memory
Capacity, bandwidth and platform support across DDR5 RDIMM, 3DS RDIMM, MRDIMM, SOCAMM2, CXL and HBM4.
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Enterprise Storage
Specifications, form factors, liquid cooling and AI storage roles of PCIe Gen6 enterprise SSDs including Micron 9650, Samsung PM1763 and Kioxia CM10.
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Enterprise Storage
Capacity, write characteristics and data tiering across QLC SSDs such as the 245.76 TB Micron 6600 ION and Kioxia LC9, and HDDs such as Seagate 44 TB and WD 40 TB.
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Server & AI Infrastructure
Rack power, power delivery, liquid cooling, interconnect and OEM platforms across HGX, MGX, Vera Rubin NVL72 and AMD Helios.
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Server & AI Infrastructure
Bandwidth budgets, PCIe topology and configuration ratios across CPU, memory, GPU, NVMe and networking.
Read more ↗TOPICS WE FOLLOW
We connect product roadmaps, workload demand and supply-chain developments with the technology and market changes that shape enterprise IT planning and hardware procurement.
Product lifecycles and market developments across automotive, industrial and general-purpose semiconductors.
Enterprise and professional computing platforms, accelerators and related system technologies.
Delivery conditions, use cases and EOL lifecycle management.
INDUSTRY PERSPECTIVES
Drawing on public technical information, product roadmaps and market observation, we put enterprise hardware developments in context for infrastructure planning and procurement decisions.
We track developments across GPUs, CPUs, memory, storage and server platforms, focusing on the changes that matter to enterprise infrastructure planning and technology procurement.
From next-generation processors and AI accelerators to high-bandwidth memory, enterprise SSDs and rack-scale systems, we examine the performance, power, capacity and system-design shifts behind each technology cycle.
By connecting public technical information, product roadmaps and market developments, we look at how enterprise hardware is evolving alongside AI, cloud computing and data-center demand.
We examine how server platforms, enterprise storage, networking and high-speed interconnects work together in infrastructure design.